SiliconPV 2018 - 8th International Conference on Crystalline Silicon Photovoltaics

[CONFERENCE]

SiliconPV 2019  will be held in Leuven, Belgium, on April 8-11, 2019. 

Event web page

SiliconPV 2018, the 8^th International Conference on Silicon Photovoltaics, and n-PV Workshop 2018   took place from March 19-22 in Lausanne, Switzerland. SiliconPV conferences series focuses since 2011 on advanced technologies, materials and concepts for crystalline Si solar cells and modules.

This year’s event took place in the amazing  EPFL campus in Lausanne (45 minutes from Neuchâtel) in the beautiful Rolex Learning center, close to the Geneva Lake, facing the alps. EPFL, ranked one of the top engineering schools in Europe, has also integrated a revolutionary grid control and energy management system on its campus covered by 2 MW of PV. 

SiliconPV conference welcomes

• Scientists, students and technologists from leading research institutes and universities
• Representatives of R&D departments of the major PV companies
• Industry decision-makers.

The chairman of the conference, prof. Cristophe Ballif highlighted participants by his welcome message  that the field of crystalline silicon technology has witnessed a wealth of new ideas being worked out at an impressive pace in recent years: reducing silicon usage significantly, manipulating material defects, creating high performance passivating contacts, inventing low-cost patterning steps, adding junctions on top of silicon, going for the ultimate module design and for the ultimate efficiency… Depending on the scenarios, the annual PV market could grow up to 500 GW in the next 12 to 20 years. In other words, we are not at the end, but just at the beginning of the solar era. Any money invested in academics, research centers or industries, is an important and justifiable investment in the future of the planet. [Ref]

Conference Topics

• Silicon material and defect engineering
• Wafering technologies
• Junction formation
• Cleaning, etching, surface morphology and surface passivation
• Carrier selective contacts and contact formation
• Advanced light management
• Advanced characterization and simulation
• Process integration and low-cost manufacturing
• Si-based tandem cells, new materials and novel approaches
• Module processing and materials
• Module reliability and production yield
• High and record efficiency devices

Invited speakers notes