Sputtering DC, RF
PV Material and device growth Equipment
Sputtering in thin film technology is a widely diffused physical vapor deposition (PVD) whereby atoms are ejected from a solid target material due to bombardment by energetic particles. This involves ejecting material from a "target" onto a "substrate" such as a silicon wafer or a glass substrate. Depending from the characteristic of exciting power supply the sputtering is catalogued in DC/RF. DC sputtering is widely utilized with metallic and conductive targets. RF sputtering is utilized to produce highly insulating oxide films. Sputtering sources often employ magnetrons that utilize strong electric and magnetic fields to confine charged plasma particles close to the surface of the sputter target intensifying the bombardment of ions. In reactive sputtering, the deposited film is formed by chemical reaction between the target material and a reagent gas which is introduced in process chamber.