European Commission
A EUROPEAN PROJECT SUPPORTED THROUGH
THE SEVENTH FRAMEWORK PROGRAMME
FOR RESEARCH AND TECHNOLOGICAL DEVELOPMENT
CHEETAH knowledge Exchange Portal is an integral part of CHEETAH project web site powered and developed by DTE unit of ENEA ©2014 - 2018 with support of all CHEETAH Partners. Starting from early 2018, CHEETAH KEP moved its first steps to became EERA Knowledge Exchange Platform for PV Technology (KEPT-PV). A new name for the previous platform characterizing our will to serve better and more efficiently in Knowledge Exchange a wider European and International PV RTD community.
highlights in this page

Sputtering DC, RF

PV Material and device growth Equipment

Sputtering in thin film technology is a widely diffused physical vapor deposition (PVD)  whereby atoms are ejected from a solid target material due to bombardment by energetic particles. This involves ejecting material from a "target" onto a "substrate" such as a silicon wafer or a glass substrate. Depending from the characteristic of exciting power supply the sputtering is catalogued in DC/RF. DC sputtering is widely utilized with metallic and conductive targets. RF sputtering is  utilized to produce highly insulating oxide films. Sputtering sources often employ magnetrons that utilize strong electric and magnetic fields to confine charged plasma particles close to the surface of the sputter target intensifying the bombardment of ions. In reactive sputtering, the deposited film is formed by chemical reaction between the target material and a reagent gas which is introduced in process chamber. 

Infrastructure

Expertise

discussions